In simple terms, pH tells us how acidic or basic a solution is, and keeping the pH at the right level is essential for these ...
LONDON — Surface Technology Systems plc, a developer of plasma etch systems, has announced that it intends to build a Deep Reactive Ion Etch (DRIE) system suitable for 300-mm diameter wafers. The ...
Lam Research Corporation (NASDAQ:LRCX) is one of the best performing NASDAQ stocks according to hedge funds. On October 2, ...
The fundamentals of a good Bosch etching system are described below; There are a number of significant features of the equipment used for Bosch processing which differ from normal ICP systems: In ...
Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...
(Nanowerk News) Imec presents a via-middle through-Si-via (TSV) approach to 3D stacking. This method is new to industry as it allows to 'reveal' TSV contacts by using a Si-etch process. The process ...
OSAKA, Japan — Mitsubishi Electric Corp. has developed a single-step, hydrofluoric acid electrochemical etching process that can achieve an aspect ratio greater than 60:1 at potentially a tenth of the ...
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