SAN JOSE — A consortium of chip-equipment makers here today announced a major deal with Ace Semiconductor to help set up the world's first wafer-level packaging production line in China. Under the ...
BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...
SAN FRANCISCO — The Semiconductor Equipment Consortium for Advanced Packaging (SECAP) today (July 3) announced it has installed a 300-mm wafer bumping and wafer-level packaging line at Unitive ...
This study investigates creation of 1.0µm RDL structures by a damascene process utilizing a photosensitive permanent dielectric material. The advantage of the photosensitive dielectric approach is ...
From powering watches to phones, handheld consoles to desktop PCs, office servers to data centers, processors can be found everywhere and in every size possible. That last aspect is set to take a ...
UnitySC continues to innovate its inspection and metrology products to deliver solutions that address the most advanced needs across semiconductor manufacturing processes. GRENOBLE, France, July 9, ...
BENGALURU, India, Oct. 21, 2025 /PRNewswire/ -- Fan-Out Wafer Level Packaging Market is Segmented by Type (High Density Fan-Out Package, Core Fan-Out Package), by Application (CMOS Image Sensor, A ...
WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced its first shipment of the Company’s Dragonfly ® G3 system with the ...
United Test and Assembly Center (UTAC), a Singapore-based assembly and test company, will continue its investment in Taiwan in 2015 by setting up a 12-inch wafer-level packaging line, according to ...
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