For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet ...

Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical, thermal, and mechanical phenomena, ...

Zinc-ion hybrid supercapacitors combine battery‑ and capacitor‑type electrodes, but their performance relies on advanced carbon materials. Here, the authors summarize how heteroatom doping enhances ...

Abstract: As the integrated chip packaging technology progresses from 2.5-D to 3-D, new issues arise regarding the reliability of interconnects. The analysis of interconnect reliability is inherently ...

Abstract: Accurate prediction of operational performance in permanent magnet synchronous motors (PMSMs), where core loss characteristics are a decisive indicator, is essential for advancing electric ...

Credit: Gorodenkoff/Shutterstock Enhances system-level engineering with expanded digital twin capabilities and connected modeling workflows that deliver deeper real ...