From Catalog ICs to Custom ICs and Security IP, a unified offering to shape the post-quantum era. SEALSQ Corp (NASDAQ: LAES), ...

Stacking dies will dramatically improve performance, but it’s still a work in progress.

What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

At SDEC 2025, industry leaders will explore how AI and local talent are shaping Malaysia’s semiconductor future.

United Microelectronics Corp. (UMC) recently issued a notice to its suppliers demanding a 15% price reduction, signaling heightened cost pressures within the semiconductor supply chain. While some ...

As noted by AppleInsider, according to the European Union’s list of acquisitions by firms it classes as gatekeepers, Apple has acquired IC Mask Design. Under the Digital Markets Act, Apple is required ...

Experts at the Table: Semiconductor Engineering sat down to discuss initial forays into 3D-ICs and what problems early adopters will encounter, with John Ferguson, senior director of product ...

Enhances collaboration on high-performance computing ASIC CPU designs powered by Arm Neoverse Compute SubsystemsTaipei, ...

Investing.com -- Sealsq Corp (NASDAQ:LAES) stock jumped 10.2% in premarket trading Friday after the company announced its integrated strategy for IC’Alps, the French ASIC design house it recently ...

A new suite of web-based design tools integrates planning, simulation, and optimization into a single workflow, redefining ...

Electronic System Design (ESD) industry revenue increased 8.6% to $5,089.4 million in the second quarter of 2025 from the ...