The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the ...

Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor ...

It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new ...

As per a CNBC report, in 2025, significant changes are expected in global AI regulation, especially in the U.S., the EU, and ...

Singapore is investing heavily in AI, but its success hinges on equipping its workforce with the skills to effectively apply ...

Micron Technology (NASDAQ:MU) announced a US$7 billion investment to build a high-bandwidth memory (HBM) chip-packaging ...

There's an appetite for AI, with Microsoft’s 2024 Work Trend Index finding that 88% of Singapore’s knowledge workers already ...

Micron invests $7 billion in Singapore's first high-bandwidth memory (HBM) facility to support growing AI demand.

The statement, released on Tuesday (Jan 7), highlights several initiatives by the Singapore National Library Board (NLB) and ...

Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at ...

VOOX Exchange, an innovative AI-driven cryptocurrency platform, has secured a significant investment of $50 million from ...