In a time when DDR5 kits can cost more than a graphics card, some builders are literally soldering their own memory sticks to ...
The white paper concludes that one-size-fits-all cleaning approaches are insufficient for advanced semiconductor packaging. Instead, manufacturers must carefully align defluxing chemistry and process ...
So, you’re trying to get a handle on chip BGA technology? It’s pretty much everywhere in our gadgets these days, from phones to more serious equipment. Basically, it’s a way to pack a lot of ...
Upgrading RAM on most computers is often quite a straightforward task: look up the supported modules, purchase them, push a couple of levers, remove the old, and install the new. However, this project ...
Abstract: A finite-element analysis model and a crosstalk analysis simulation model of stacked ball grid array package (BGA) solder joint interconnection structure were established, and the ...
This week starts off with examinations of a couple hardware attacks that you might have considered impractical. Take a Ball Grid Array (BGA) NAND removal attack, for instance. The idea is that a NAND ...
Effect of Warpage on Solder Joint Fatigue Life by Influencing the Solder Joint Shape in BGA Packages
Abstract: Warpage occurring during surface-mount assembly reflow processes may lead to severe solder bump reliability problems. In this research, a finite-element simulation analysis of the effect of ...
Ball Grid Array (BGA) packaging is a game-changer in electronics. Unlike traditional packaging methods, BGA replaces pins with solder balls, significantly improving the connection between the ...
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